■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) : <br /> <br />Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents. <br /> <br />Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel. <br /> <br />Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials. <br /> <br />■ Adsorbable Material <br />(1) Metal conductor (e.g., copper foil) <br />(2) Semiconductors (e.g., silicon, GaAs) <br />(3) Insulators (e.g., paper, glass substrate) <br />(4) Porous objects. <br />(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness. <br />(6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd. <br /> <br />■ Operational Environment <br />(1) Atmospheric Pressure. <br />(2) Vacuum Environment. <br /> <br />■ Main Handling Applications <br />(1) Thin and large size flat glass. <br />(2) Semiconductor thin wafers. <br />(3) Big Size Wafer Handling and Moving. <br />(4) Warp wafers. <br />(5) Move-Free Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck). <br />(6) Soft copper foil. <br />(7) Soft film. <br />(8) Curved glass. <br />(9) Vacuum Lamination for OLED or Touch Panel. <br />(10) Vacuum deposition. <br /> <br />■ Main Products <br /> <br />① (Move-Free) Thin Wafer Supporter <br />1. Be able to keep adhesion without power source connection. <br />2. Need connect controller for about 30 seconds to switch the adhesion state. <br />3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power. <br />4. Maximum operating temperature: 250 degrees centigrade. <br />5. Suitable for soft and thin object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier). <br /> <br />② (Wired) Stage Holder <br />1. Real time power switch to set adsorption or release. <br />2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface). <br />3. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.) <br /> <br />③ (Cordless) Palm: <br />1. Use battery as power source. <br />2. Suitable to adhere small and lightweight objects. (Eg, 12 "wafers, 7" flat glass.) <br /> <br />④ Other Custom E-Chuck: <br />1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects) <br />2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.) <br />3. Anti-wrinkle E-Chuck (Eg, soft copper foil.) <br /> <br />Contact info : <br />E-mail : sales@edragontek.com <br />EDRAGON TECHNOLOGY CORPORATION
