Taiwan Semiconductor Manufacturing Company reaffirmed Thursday that construction of its second advanced packaging plant in Chiayi County is proceeding as planned, countering reports of a suspension. Construction began last year on one of two advanced packaging plants at the Southern Taiwan Science Park’s Taibao City campus, according to the Taipei Times. Completion is set for 2026, and mass production is targeted for 2028. The project underscores Taiwan Semiconductor’s push to meet soaring AI demand, which has lifted its stock more than 36% this year, outpacing the Nasdaq 100’s 16% gain. The company continues to expand globally, with major fabrication and packaging commitments in the U.S., Japan, and Germany, while navigating political tensions between Washington, Taipei, and Beijing. Shares were down 1.12% at $265.65 in premarket trading on Friday.
