A Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits. It has been developed to provide a solution to the problem of producing a robust and convenient package for an integrated circuit with many hundreds of pins.<br /><br />Its main advantages are:<br />- Improved connectivity<br />- Lower thermal resistance<br />- Shorter leads within the chip<br /><br />The main issue with BGA components is that, once the package is soldered down, it is not possible to view the soldered connections using traditional optical methods. But X-ray inspection overcomes this problem.<br /><br />Avizo Fire 3D imaging and analysis software provides a comprehensive set of tools to analyze the reliability of BGA components, enabling the accurate void analysis inside the solder balls. More info about Avizo Fire: http://www.avizo3d.com<br /><br />Data ® nanoX Technology Pte Ltd
